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NOIL2SM1300A
Table 22. MECHANICAL SPECIFICATIONS
Parameter
Die
(Pin 1 is located
bottom left)
Glass Lid
Mechanical Shock
Vibration
Description
Die thickness
Die position, X offset to the package center
Die position, Y offset to the package center
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the die center (X-dir)
Optical center referenced from the die center (Y-dir)
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
XY size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to Figure 36)
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Min
NA
NA
NA
-1
-1
-50
-1
NA
NA
NA
NA
NA
NA
400
NA
NA
20
Typ
750
-42
-150
0
0
0
0
-121
+2280
1.75
1.15
27.4 x 27.4
0.9
-
<0.8
2000
-
Max
NA
NA
NA
1
1
50
1
NA
NA
NA
NA
NA
NA
1100
NA
NA
2000
Units
m m
m m
m m
deg
deg
m m
deg
m m
m m
mm
mm
mm
mm
nm
%
G
Hz
Mounting Profile
Pb-free wave soldering profile for pin grid array package if no socket is used
Recommended Socket
Manufacturer
Andon Electronics (www.andonelectronics.com)
http://onsemi.com
40
BGA Socket: 10-24-05-168-319T-P27-L14
Thru Hole: 10-24-05-168-347T-P27-L14
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